JD-1000

Silicone-Free Mold Release Agent for PCB Lamination

Silicone-free and oil-free release performance engineered for high-temperature PCB lamination, clean processing and accurate positioning.

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Product Overview

JD-1000 is designed for multilayer PCB lamination processes where cleanliness and reliable release performance are critical. It supports processing temperatures up to 260°C and is formulated for easy cleaning with no silicone or oil contamination.

Key Advantages

100% Silicone-FreeHelps reduce contamination risk

Up to 260°CStable in high-temperature lamination

Zero ResidueClean release and easy maintenance

Process EfficiencyHelps reduce cleaning time

Applications

Multilayer PCBHigh-layer-count boards

High-Frequency PCBPrecision lamination processes

CCA ProductionElectronic assembly processing

FPC BoardFlexible circuit applications

Compliance & Documentation

Product compliance documents, safety data and application guidance are available from our technical team upon request.

Discuss Your Application

Tell us your materials, temperature and process requirements.

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